The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
Apr. 14, 2003
Applicant:
Inventor:
Mark M. Konarski, Old Saybrook, CT (US);
Assignee:
Henkel Corporation, Rocky Hill, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 5/950 ; C08L 6/304 ; H01L 2/158 ; H01L 2/329 ;
U.S. Cl.
CPC ...
C08F 5/950 ; C08L 6/304 ; H01L 2/158 ; H01L 2/329 ;
Abstract
Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.
Konarski, Mark. (2004). Underfill sealant of epoxy resins, adhesion promotor and curative of n-containing compound and transition metal complex (U.S. Patent No. 6818318). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6818318
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile