The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6817918 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 16, 2004

Filed:

Jun. 08, 2001
Applicant:
Inventors:

Holger Claus, Lake Forest, CA (US);

Randal S. Kincade, Irvine, CA (US);

Steven Osowski, Wildomar, CA (US);

Assignee:

Ushio America, Inc., Cypress, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 9/00 ; H05B 3/310 ;
U.S. Cl.
CPC ...
H01J 9/00 ; H05B 3/310 ;
Abstract

The present invention is a hybrid sealing technique. According to one or more embodiments of the present invention, an unsealed lamp body is heated and a partial pinch seal is performed on a first side of the lamp body at an outer junction area. Then, a shrink seal is applied which completes the sealing process at the first side of the lamp body by sealing an inner junction area on the same side of the lamp body. The present invention retains the benefits of the shrink seal, but alleviates the difficulty associated with holding the electrode assemblies in place when performing a traditional shrink seal. In addition, the machine which holds the electrode assemblies in place is greatly simplified.


Find Patent Forward Citations

Claus, Holger. (2004). Hybrid sealing technique (U.S. Patent No. 6817918). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6817918

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…