The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2004

Filed:

Jan. 04, 2001
Applicant:
Inventors:

Hiroyuki Kakita, Himeji, JP;

Tatsuo Maruo, Hyogo, JP;

Takumi Hatsuda, Takasago, JP;

Yoshio Irie, Himeji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B02C 1/912 ;
U.S. Cl.
CPC ...
B02C 1/912 ;
Abstract

The present invention provides: a process for treating a particulate water-absorbent resin, which enables to carry out pulverization stably in a process for producing a particulate water-absorbent resin, and transportation or storage of the particulate water-absorbent resin stably during or after producing the particulate water-absorbent resin, and to prevent contamination of cohered matters of the particulate water-absorbent resin; and involves no or little deterioration of properties. The process for treating a particulate water-absorbent resin is characterized by carrying out at least one selected from the group consisting of: (1) heating at least one portion of a surface getting contact with the particulate water-absorbent resin from the outside, (2) maintaining the temperature of at least one portion of a surface getting contact with the particulate water-absorbent resin at 30 to 150° C., and (3) maintaining the temperature of at least one portion of a surface getting contact with the particulate water-absorbent resin above a temperature that is lower than a temperature of the particulate water-absorbent resin by 20° C.


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