The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2004
Filed:
Mar. 24, 2003
Applicant:
Inventor:
Kazuaki Ano, Hiji-machi, JP;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
An assembly of a semiconductor chip ( ) having an integrated circuit (IC) including at least one contact pad ( ) on its surface ( ), wherein the contact pad has a metallization suitable for wire bonding, and an interconnect bonded to said contact pad. This interconnect includes a wire ( ) attached to the pad by ball bonding ( ), a loop ( ) in the wire closed by bonding the wire to itself ( ) near the ball, and a portion ( ) of the remainder of the wire extended approximately parallel to the surface. The interconnect can be confined to a space ( ) equal to or less than three ball heights from the surface.