The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2004

Filed:

Oct. 08, 2002
Applicant:
Inventors:

Rencai Chu, Atsugi, JP;

Kanichi Kadotani, Atsugi, JP;

Toshinobu Tanimura, Hiratsuka, JP;

Assignee:

Komatsu Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract

An objective of the present invention is to provide a thermoelectric module which can achieve high heat release and heat absorption efficiencies and which can obviate any thermal stress-caused damages. A thermoelectric module ( ) in an embodiment has a predetermined number of thermoelectric semiconductor elements P and N which are arranged in a flat plate configuration. Each of the thermoelectric semiconductor elements P and N has on one face thereof a one-side electrode ( ) and has on the other face thereof an other-side electrode ( ), thereby allowing all of the thermoelectric semiconductor elements P and N to be connected in series. The one-side electrodes ( . . . ) have heat release/heat absorption fins (heat transfer fins) ( F, F . . . ) and the other-side electrodes ( . . . ) have heat release/heat absorption fins (heat transfer fins) ( F, F . . . ).


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