The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6815260 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 09, 2004

Filed:

May. 24, 2002
Applicant:
Inventor:

Yoshihiko Ino, Miyazaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract

A method of making a semiconductor device comprises the steps of coating a first face of an insulative board ( ) with a thermally plastic resin ( ), bonding at least one semiconductor element ( ) onto the thermally plastic resin ( ), piercing the thermally plastic resin ( ) and the insulative board ( ) with at least one capillary that holds a metal wire ( ), forming a metal ball ( ) and pulling out the capillary from the insulative board ( ) and the thermally plastic resin ( ), pressing the capillary onto an electrode ( ) of the semiconductor element ( ) and cutting off an extra wire, and attaching at least one metal bump ( ) to the second face of the insulative board ( ) so as to be connected to the metal ball ( ).


Find Patent Forward Citations

Ino, Yoshihiko. (2004). Method of making semiconductor device (U.S. Patent No. 6815260). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6815260

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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