The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2004

Filed:

Apr. 20, 2001
Applicant:
Inventors:

Masaaki Yokoyama, Yokkaichi, JP;

Masahiro Tanaka, Yokkaichi, JP;

Assignee:

JSP Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/26 ;
U.S. Cl.
CPC ...
B32B 3/26 ;
Abstract

A foam layer can be formed at a temperature at which the surface quality of a surface layer is not deteriorated, and a molding technique that is excellent in adhesiveness of a foam layer and a surface layer or/and a base member is developed. For the purpose of obtaining a resin molding composite, the present invention is characterized by a polyolefin resin molding composite comprising a surface layer and a foam layer, or a surface layer, a foam layer, and a base member, wherein the foam layer comprises a foam layer produced by fusion bonding thermoplastic expanded resin particles one another by molding, where the thermoplastic expanded resin particles comprises a core that is made of a crystalline thermoplastic resin and is in an expanded state and a polyethylene resin coat covering the core, and the surface layer comprises a thermoplastic synthetic resin having a melting point of 5° C. or more higher than a melting point of polyethylene resin constituting the coat of the particles.


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