The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2004

Filed:

May. 03, 2002
Applicant:
Inventors:

Masato Sagawa, Kyoto, JP;

Tochihiro Watanabe, Kyoto, JP;

Hiroshi Nagata, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/12 ;
U.S. Cl.
CPC ...
B22F 3/12 ;
Abstract

A powder compaction method in which a powder p is filled by air tapping or other suitable method into a mold , then while the mold being filled with the powder, the powder particles are bound with each other without application of force from outside the mold to form a compact C, and then the compact C is taken out from the mold . This method produces a variety of shapes of the compact far greater than in conventional methods, and net shape manufacturing of products with complex shapes is made possible by this method. Because this method uses far less binder compared to MIM and PIM that are expected as methods for producing products with complicated shapes, the time needed for elimination of the binder is much shorter than in MIM and PIM.


Find Patent Forward Citations

Loading…