The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2004
Filed:
Nov. 18, 2002
Applicant:
Inventor:
Jesse L. Pedigo, Chippewa Falls, WI (US);
Assignee:
TTM Advanced Circuits, Inc., Chippewa Falls, WI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 6/708 ; B29C 7/080 ; B29C 7/088 ;
U.S. Cl.
CPC ...
B29C 6/708 ; B29C 7/080 ; B29C 7/088 ;
Abstract
A method for filling vias in an electronic substrate which includes providing a source of fill material; providing a pressure head coupled to the source of fill material via a fill material inlet, the pressure head further comprising an elongated fill material outlet which is substantially larger than the fill material inlet; placing the pressure head in contact with the electronic substrate; and pressurizing the fill material to inject fill material into the vias of the electronic substrate.