The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2004

Filed:

Dec. 05, 2000
Applicant:
Inventor:

Seiji Morita, Yokohama, JP;

Assignee:

Discovision Associates, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 1/100 ;
U.S. Cl.
CPC ...
B29D 1/100 ;
Abstract

The invention relates to methods for making mold tools. More particularly, the mold tools are used for molding a resin substrate which has fine pits, i.e., concavities and protuberances. The invention also pertains to a method for manufacturing a resin substrate. Such resin substrates may be used as an optical disk, a magnetic disk, a hard disk, etc., for recording data. According to a preferred embodiment of the invention, a first metallic (Ni) mold tool (father) is made which is a duplicate of a master substrate, then a resin mold tool (mother) is made which is a duplicate of the first metallic mold tool and finally a second metallic (Ni) mold tool (son) is made which is a duplicate of the resin mold tool. Both the father and son may be referred to a “stamper”. The invention also relates to methods of manufacturing a mold tool for molding the base of an optical disk having at least one signal recording region and at least one non-signal recording region. The invention also relates to stampers used to make optical disks which have a signal recording region and a non-signal recording region.


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