The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2004

Filed:

Oct. 22, 2002
Applicant:
Inventors:

Ladislav Rudolf Pust, Savage, MN (US);

Declan Macken, Prior Lake, MN (US);

Tracy C. Baresh, Luck, WI (US);

Ibro Tabakovic, Edina, MN (US);

Venkateswara R. Inturi, Shakopee, MN (US);

Assignee:

Seagate Technology LLC, Scotts Valley, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/60 ; G11B 1/564 ; G11B 1/732 ; G11B 2/120 ; G11B 5/127 ;
U.S. Cl.
CPC ...
G11B 5/60 ; G11B 1/564 ; G11B 1/732 ; G11B 2/120 ; G11B 5/127 ;
Abstract

A transducing head formed upon a slider has a transducer, an electrical contact layer, a stud electrically connected to the contact layer, and a bond pad electrically connected to the stud. The electrical contact layer is electrically connected to the transducer. The stud is formed of a material having a coefficient of thermal expansion less than about 1.3 times a coefficient of thermal expansion of a slider material forming the slider. The bond pad has a metallic underlayer and a top layer. The metallic underlayer is formed of a material having a coefficient of thermal expansion less than about 1.1 times the coefficient of thermal expansion of the slider material.


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