The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
May. 20, 2003
Applicant:
Inventors:
Hisashi Matsuyama, Ogaki, JP;
Mitsuru Okigawa, Nagoya, JP;
Assignee:
Sanyo Electric Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/329 ;
U.S. Cl.
CPC ...
H01L 2/329 ;
Abstract
A semiconductor integrated device that resists breakage of an internal wire. An epoxy resin covers a lower surface and side surface of a semiconductor chip. An internal pad connecting an external wire and an internal wire are formed on a silicon oxide film. The internal pad is wider than the internal wire. A portion at which the internal pad and the internal wire are connected to each other is located above the semiconductor chip. The internal pad disperses stress resulting from changes in the volume of the epoxy resin caused by temperature changes. Accordingly, stress does not concentrate in the internal wire.