The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
Oct. 30, 2002
Applicant:
Inventors:
Assignee:
Fuji Electric Co., Ltd., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/940 ;
Abstract
A semiconductor device in which accuracy in mounting and positioning a semiconductor chip onto a package is improved without being affected by operation of a mounting unit such as a die bonder. The semiconductor device includes a semiconductor chip disposed on a die pad section of the package using guide projections and spring projections provided around the die pad section. The semiconductor chip is die bonded while being aligned with reference to the guide projections.