The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2004

Filed:

Mar. 10, 2003
Applicant:
Inventor:

Chien-Hung Chen, Taipei, TW;

Assignee:

Everstone Industry Corp., Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G10O 1/506 ; G03G 1/300 ;
U.S. Cl.
CPC ...
G10O 1/506 ; G03G 1/300 ;
Abstract

A memory card substrate includes a first solder pad assembly formed on a top edge of the memory card substrate. The first solder pad assembly has multiple first solder pads equally spaced from each other and multiple first gaps each sandwiched between two adjacent first solder pads. A second solder pad assembly is formed on a bottom edge of the memory card substrate and has multiple second solder pads equally spaced from each other and multiple second gaps each sandwiched between two adjacent second solder pads. Each first solder pad corresponds to one of the second gaps so that the first solder pads are alternately arranged on the top edge relative to the second solder pads on the bottom edge.


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