The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
Mar. 12, 2002
Claude L. Bertin, South Burlington, VT (US);
Erik L. Hedberg, Essex Junction, VT (US);
Russell J. Houghton, Essex Junction, VT (US);
Max G. Levy, Essex Junction, VT (US);
Rick L. Mohler, Williston, VT (US);
William R. Tonti, Essex Junction, VT (US);
Wayne M. Trickle, Fairfax, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Method for forming a first one time, voltage programmable logic element in a semiconductor substrate of first conductivity type, forming a first layer beneath a surface of the substrate, the first layer having a second conductivity type. A trench is formed through the surface and passing through the first layer. The trench comprises an interior surface, a dielectric material lining the interior surface and a conductive material filling the lined trench. The first logic element is configured so that a predetermined voltage or higher applied between the conductive material and the first layer causes a breakdown within a region of the trench.