The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
Jun. 05, 2003
Applicant:
Inventor:
Stephen Beaudoin, West Lafayette, IN (US);
Assignee:
Arizona Board of Regents, Tempe, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 7/04 ;
U.S. Cl.
CPC ...
B24B 7/04 ;
Abstract
In a slurry solution for chemical mechanical planarization (CMP) of a semiconductor wafer, an abrasive particle is provided having a central body and a plurality of extensions from the central body of the abrasive particle. The plurality of extension hold a center of mass of the abrasive particle a distance from the semiconductor wafer during the CMP process. The extensions extend 3-dimensionally from the central body, with the length of one extension being about 30 nm. The extensions reduce attractive forces acting on the central body allowing the abrasive particles to be removed from the semiconductor wafer during a post-CMP cleaning process.