The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
Feb. 19, 2002
Takeo Kitayama, Scarsdale, NY (US);
Atsushi Saitoh, Sakata, JP;
Sumitomo Chemical Company, Ltd., Osaka, JP;
Abstract
A mold clamping unit employed in an injection molding apparatus for opening and closing a mold having a movable mold plate and a fixed mold plate. The mold clamping unit comprises a mold clamping cylinder, mold opening means for applying a mold opening force of a predetermined magnitude to the movable mold plate in the direction from the closed position to the fully open position and moving the movable mold plate from the closed position to the predetermined half-open position located between the closed position and fully open position, and switching means for switching the mold clamping force generated by the mold clamping cylinder between the first mold clamping force which is larger than the mold opening force and a second mold clamping force which is smaller than the mold opening force by switching the supply pressure of working fluid supplied to the mold clamping cylinder. In such a configuration, special mold opening means for moving the movable mold plate from the closed position to the half-open position is provided separately in addition to the mold clamping cylinder. As a result, the movable mold plate can be accurately moved to the half-open position.