The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2004
Filed:
Jun. 11, 2003
Applicant:
Inventors:
Assignee:
Dongbu Electronics Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/900 ;
U.S. Cl.
CPC ...
G06F 1/900 ;
Abstract
Disclosed is a method for inspecting defects of a wafer of a semiconductor device, wherein the wafer is set up with reference coordinates for a respective die so that inspection time is reduced and the defects are classified by the respective die. The method may be carried out by a defect analysis system comprising an inspection station for inspecting defects of the wafer and a review station for precisely re-inspecting defects. The method includes the steps of: providing the respective die with a serial number, the plural dies being formed on the wafer; and setting up coordinates for a plane of the respective die based on one edge of the die as reference point.