The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2004
Filed:
Nov. 30, 2001
Applicant:
Inventors:
Takatomo Toda, Toyoshina-machi, JP;
Naoki Makino, Matsumato, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 3/10203 ; G09G 3/36 ; G03H 1/04 ;
U.S. Cl.
CPC ...
H01L 3/10203 ; G09G 3/36 ; G03H 1/04 ;
Abstract
Disclosed is a semiconductor chip mounting substrate bearing semiconductor chips and thereof. The first substrate includes a power source line for supplying a supply voltage potential to the semiconductor chips and a ground line for supplying a ground voltage potential to the semiconductor chips and output lines and to which an output signal is supplied from the semiconductor chips and and an insulator layer for covering the output lines and The insulator layer is formed so that no insulator layer is arranged in the area between the power source line and the ground line