The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2004

Filed:

Jul. 30, 2001
Applicant:
Inventors:

Teruhisa Hayashi, Gifu, JP;

Yasutake Hotta, Aichi, JP;

Kouki Ogawa, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 ;
U.S. Cl.
CPC ...
H05K 1/16 ;
Abstract

A printed wiring substrate includes a core substrate having a front surface and a back surface and an chip capacitor serving as an electronic component embedded via a resin in a through-hole extending through the core substrate between the front surface and the back surface . The chip capacitor has an electrode projecting from the upper and lower ends thereof. The resin contains silica filler (inorganic filler) f. The maximum particle size d of the silica filler f is not greater than half the height h of the electrode


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