The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2004
Filed:
Oct. 19, 1999
Hidekazu Takeyama, Kanagawa, JP;
Tomohiro Kawasaki, Kanagawa, JP;
Masahiko Ohnishi, Kanagawa, JP;
Minoru Matano, Kanagawa, JP;
Akira Ozaki, Kanagawa, JP;
Katsuyuki Arima, Milton Keynes, GB;
Other;
Abstract
The invention relates to a pressure sensitive sealant composition for sealing a clearance between a lamp unit housing and a vehicle body panel of an automotive vehicle. The pressure sensitive sealant composition includes (a) 10-40 wt % of a component A that is at least one copolymer selected from the group consisting of hydrogenated styrene-butadiene copolymers, hydrogenated styrene-isoprene copolymers, and modified copolymers thereof; (b) a component B that is at least one tackifier selected from the group consisting of petroleum resins, terpene resins, rosin resins, coumarone-indene resins, hydrogenated resins thereof, and modified resins thereof, and (c) a component C that is a hydrocarbonic plasticizer. The pressure sensitive sealant composition is prepared by maxing together 100 parts by weight of the component A, 20-60 parts by weight of said component B, and 150-400 parts by weight of said component C. In order to apply the pressure sensitive sealant composition for the purpose of saealing, the pressure sensitive sealant composition is heated end directly applied in the state of a bead onto a member to be sealed, or otherwise applied to the member after it has been formed into the bead state.