The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2004
Filed:
Feb. 14, 2003
Applicant:
Inventors:
Nobuhiro Ichiroku, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Assignee:
Shin Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 2/738 ;
U.S. Cl.
CPC ...
B32B 2/738 ;
Abstract
A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.
Ichiroku, Nobuhiro. (2004). Heat resistant resin composition and adhesive film (U.S. Patent No. 6808819). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6808819
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile