The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2004
Filed:
Aug. 21, 2003
Ryan S. Berkely, Long Beach, CA (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
For qualification testing in product development, a test assembly contains a surrogate circuit board ( ) and surrogate electronic modules ( ) supported thereon. The terminals ( ) of the modules are joined to respective bonding pads ( ) on the circuit board to form bonded joints. The modules terminals and the wiring of the associated bonding pads is configured to produce at least one test series circuit ( ) associated with each module that includes the bonded joints. A tester ( ) supported on the circuit board monitors the test series circuit and produces a persistent indication ( ) should a break or interruption occur in a bonded joint or any other portion of the test series circuit. This allows indications of transient breaks that occurred when the test assembly was being subjected to stresses, such as those induced by temperature excursions, mechanical vibration, and/or mechanical shock to be preserved and recorded at a later time.