The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6806431 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 19, 2004

Filed:

Jul. 25, 2003
Applicant:
Inventors:

You Kondoh, Yamato, JP;

Tsutomu Takenaka, Hachioji, JP;

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 2/900 ;
U.S. Cl.
CPC ...
H01H 2/900 ;
Abstract

A micro-relay device is provided including a fluid non-conductor. A first substrate and a second substrate are bonded together. A channel is defined in at least one of the substrates, and has a liquid metal in the channel. Electrodes are spaced along the channel and selectively interconnectable by the liquid metal. An open via is defined in one of the substrates and contains the fluid non-conductor. A heater substrate includes a suspended heater element in fluid communication with the open via. The suspended heater element is operable to cause the fluid non-conductor to separate the liquid metal.


Find Patent Forward Citations

Kondoh, You. (2004). Liquid metal micro-relay with suspended heaters and multilayer wiring (U.S. Patent No. 6806431). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6806431

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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