The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2004
Filed:
Mar. 29, 2002
Applicant:
Inventor:
Uwe Kaltenborn, Baden-Dättwil, CH;
Assignee:
ABB Research LTD, Zurich, CH;
Primary Examiner:
Int. Cl.
CPC ...
C08L 8/306 ;
U.S. Cl.
CPC ...
C08L 8/306 ;
Abstract
Mold-release agent for producing thermoset moldings with a hydrophobicized surface, where the agent comproses (I) at least one compound with mold-release action, and also (ii) at least one reactive, where appropriate hydrolyzable, silane compound, which is capable of reacting chemically in situ with the thermoset surface which forms during the molding process. The use of a mold-release agent of this type in a molding process and/or in a post-curing process for the production of thermoset moldings with a hydrophobicized surface, and also the moldings produced in this way.