The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2004
Filed:
Dec. 18, 2002
Applicant:
Inventors:
Atsushi Ohtake, Hitachi, JP;
Kinya Kobayashi, Hitachi, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract
This invention provides an inspection method and device which can efficiently measure the surface uniformity of a semiconductor device which is chemically and mechanically polished based on measured data at several points on the surface of the chip.
Ohtake, Atsushi. (2004). Method and device for assessing surface uniformity of semiconductor device treated by cmp (U.S. Patent No. 6806098). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6806098
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile