The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2004
Filed:
Oct. 24, 2001
Ron Brown Hahn, Temperance, MI (US);
Kim Robert Hamner, Dearborn, MI (US);
ThyssenKrupp Budd Company, Troy, MI (US);
Abstract
Vacuum assisted molding apparatus provides reliable sealing about the mold cavity while minimizing the area of the plant floor space occupied by the mold. The apparatus includes an upper die, a lower die, a vacuum source, and a sealing assembly. The upper die includes a generally horizontal molding surface and vertically extending sides. The lower die includes a generally horizontal molding surface cooperating with the upper die to form a mold cavity. The sealing assembly is operable to create a vacuum surrounding the mold cavity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile