The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2004
Filed:
Jun. 26, 2000
Kurt Weiblen, Metzingen, DE;
Anton Doering, Reutlingen, DE;
Juergen Nieder, Reutlingen, DE;
Frieder Haag, Reutlingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.