The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2004
Filed:
Aug. 27, 2001
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference . At the bottom of the package is a shield electrode , on which a chip is mounted via an adhesion layer . The chip and the internal contact electrode are electrically connected by an interconnection wire . Location aligning for the chip and the interconnection wire , at least either one of these, is conducted by making use of a region , which is non-electrode portion, provided on the inner bottom surface of the package