The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2004
Filed:
Jan. 13, 2004
Applicant:
Inventor:
Tomoe Suzuki, Aichi, JP;
Assignee:
NGK Spark Plug, Co., Ltd., Aichi-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H05K 1/03 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H05K 1/03 ;
Abstract
A wiring substrate includes a solid layer formed on the core substrate to partially cover the same. At least one resin dielectric layer is formed on the solid layer and the core substrate while a plurality of pads are formed on the resin dielectric layer and are exposed at the main surface of the wiring substrate. First pads are located within a region above the solid layer and second pads located outside of that region. First top-flattened solder bumps are formed on the first pads and second top-flattened solder bumps are formed on the second pads. The bumps all include a top face of the same diameter.