The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2004

Filed:

Jan. 10, 2003
Applicant:
Inventors:

Nikhil Kelkar, San Jose, CA (US);

Neeraj Anil Pendse, Mountain View, CA (US);

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract

Semiconductor device packages having top and bottom interconnecting surfaces that can be connected to external electrical systems are described. These packages include internal contact leads that are bent such that they extend from a top surface to a bottom surface of the package and thereby form the corresponding interconnecting surfaces. In some embodiments, a solder ball is formed on either the top or bottom portion of the contact leads so that the solder balls form one of the contact surfaces of the package.


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