The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2004
Filed:
Mar. 27, 2002
Applicant:
Inventors:
Tohru Tanaka, Tokyo, JP;
Yasuhisa Kitajima, Tokyo, JP;
Assignee:
Ando Electric Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27B 5/12 ; F27D 3/00 ; G01R 3/102 ;
U.S. Cl.
CPC ...
F27B 5/12 ; F27D 3/00 ; G01R 3/102 ;
Abstract
An apparatus and method for heating semiconductor devices (DUTs) having a variety of package shapes. The apparatus has a plurality of trays on which DUTs are mounted. A heating chamber with a plurality of stages, house the tray. A tray moving mechanism moves the trays so as to be disposed within the heating chamber and outside of the heating chamber. The method has the steps of supplying the DUTs on a tray, heating the DUTs supplied on each tray, and relocating and measuring the DUTs.
Tanaka, Tohru. (2004). Apparatus for and method of heating semiconductor devices (U.S. Patent No. 6803547). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6803547
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