The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2004
Filed:
Dec. 04, 2001
Applicant:
Inventors:
Masamoto Tago, Tokyo, JP;
Yoshihiro Tomita, Tokyo, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ;
Abstract
A plurality of semiconductor chips each having an electrode surface are sequentially laminated and mounted. Initially, the electrode surfaces of the semiconductor chips are activated. Then, the semiconductor chips are positioned. Successively, the semiconductor chips are laminated and bonded by pressing such that a reaction layer is not formed or formation of the reaction layer is suppressed excessively. Finally, the semiconductor chips are entirely heated so as to form the reaction layer after lamination and bonding of all the semiconductor chips are completed.