The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2004
Filed:
Aug. 09, 2001
Applicant:
Inventor:
Haruhiko Ikeda, Omihachiman, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 5/06 ; C09J 9/02 ;
U.S. Cl.
CPC ...
C09J 5/06 ; C09J 9/02 ;
Abstract
The present invention relates to a method of bonding a conductive adhesive and an electrode together, which is capable of obtaining electrical bonding between a conductive electrode and an electrode. In this method, a conductive adhesive containing a conductive filler and an organic binder is coated on an electrode having a layer formed thereon by plating a low-melting-point material, and then heated to cure the organic binder and melt the plated layer on the electrode. As a result, the conductive filler contained in the adhesive enters the plated layer to obtain strong bonding between the plated layer and the conductive filler.