The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2004
Filed:
Dec. 19, 2001
Applicant:
Inventor:
Milton Lee Buschbom, Plano, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A substrate ( ) for an unpackaged integrated circuit (IC) chip ( ). The substrate comprises an insulative material ( ), a plurality of contacts ( ) disposed thereon, and a conductive ring ( ) disposed around the outer perimeter of the contacts ( ). Conductive traces ( ) may be disposed around one or more contacts ( ) and may be coupled to the conductive ring ( ). An electro-less plating technique is utilized to plate contacts ( ), avoiding unnecessary conductive material such as plating stubs being included in the contact ( ) pattern, reducing interference. The conductive ring ( ) shields the chip ( ) from interference.