The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2004

Filed:

Dec. 26, 2000
Applicant:
Inventors:

Gene R. Anderson, Albuquerque, NM (US);

Marcelino G. Armendariz, Albuquerque, NM (US);

Johnny R. F. Baca, Albuquerque, NM (US);

Robert P. Bryan, Albuquerque, NM (US);

Richard F. Carson, Albuquerque, NM (US);

Dahwey Chu, Albuquerque, NM (US);

Edwin B. Duckett, III, Albuquerque, NM (US);

Frederick B. McCormick, Albuquerque, NM (US);

David W. Peterson, Sandia Park, NM (US);

Gary D. Peterson, Albuquerque, NM (US);

Cathleen A. Reber, Corrales, NM (US);

Bill H. Reysen, Lafayette, CO (US);

Assignee:

Emcore Corporation, Somerset, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/36 ;
U.S. Cl.
CPC ...
G02B 6/36 ;
Abstract

An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.


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