The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2004

Filed:

Mar. 28, 2002
Applicant:
Inventors:

Toshiyuki Honda, Kawasaki, JP;

Kazuto Tsuji, Kawasaki, JP;

Masanori Onodera, Kawasaki, JP;

Hiroshi Aoki, Kawasaki, JP;

Izumi Kobayashi, Kawasaki, JP;

Susumu Moriya, Kawasaki, JP;

Hiroshi Kaiya, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3/10203 ;
U.S. Cl.
CPC ...
H01L 3/10203 ;
Abstract

A semiconductor device includes a resin housing provided with a functional part, a wire pattern made of a conductive material and molded in the resin housing, a part of the wire pattern being exposed from the resin housing, an electronic part connected with the wire pattern in a state where the electronic parts is molded in the resin housing, and a semiconductor element connected to the part of the wire pattern being exposed from the resin housing. The semiconductor element provides a designated function in cooperation with a functional part of the resin housing.


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