The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2004
Filed:
Jul. 31, 2002
Applicant:
Inventor:
Hiroshi Maeda, Matsubara, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/100 ;
U.S. Cl.
CPC ...
B23K 1/100 ;
Abstract
In a planer type semiconductor device production apparatus having an interconnector to lead out an output of a planer type semiconductor element electrically connected with an external output electrode of the planer type semiconductor element through parallel gap welding, a weld bed on which is mounted a planer type semiconductor element to be welded is formed of a material with stainless steel as the main component. As a result, a planer type semiconductor device production apparatus that can conduct favorable welding, and a method of fabricating a planer type semiconductor device using such a production apparatus are obtained.