The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2004
Filed:
May. 16, 2003
Tsutomu Wada, Higashiyamato, JP;
Masachika Masuda, Tokorozawa, JP;
Other;
Abstract
For the manufacturing of semiconductor devices, in which multiple semiconductor chips which are mounted on a wiring substrate are processed for block molding and thereafter the wiring substrate is diced into individual resin-molded semiconductor devices, here is disclosed a technique for finding out easily, even after the dicing process, the position of each resin-molded semiconductor device in its former state on the wiring substrate. It includes processing steps of implementing the block molding with resin for multiple semiconductor chips mounted on a wiring substrate and thereafter dicing the wiring substrate into individual resin-molded semiconductor devices, with the substrate dicing step being preceded by a step of appending an address information pattern to each of the resin-molded semiconductor devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile