The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2004
Filed:
Jul. 23, 2002
Applicant:
Inventor:
Masaki Okamoto, Yokkaichi, JP;
Assignee:
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/3405 ;
U.S. Cl.
CPC ...
H01R 1/3405 ;
Abstract
In a process of secondary insert molding, a molten resin is injected into a cavity ( ) for secondary molding that is formed by bring a clipping portion ( ) of a mold for secondary molding into contact with an outer surface of a primary molding article ( ). Projecting areas of ends ( A) of terminals ( ) on an outer surface of a resin molding portion ( ) are formed of a primary molding resin portion ( ). Thus, the cavity ( ) for secondary molding and clipping portion ( ) are in a position where the ends ( A) of the terminals ( ) do not contact the cavity ( ) and clipping portion ( ).