The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2004

Filed:

Dec. 11, 2000
Applicant:
Inventor:

Masayuki Kondo, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 3/342 ;
U.S. Cl.
CPC ...
B29C 3/342 ;
Abstract

An apparatus in which a pair of hollow molding portions and for molding in which a terminal connecting portion with a terminal fitting crimped onto a conductor at a tip portion of a sheathed wire is accommodated and set are provided inside a mold made up by an upper mold and a lower mold , a molding resin in a molten state being injected and poured into the molding portions and to cover and mold the terminal connecting portion so as to provide waterproofing, the terminal connecting portion subjected to covering and molding being released from the mold so as to be removed outside the mold. A casting surface of the molding portion of the upper mold is provided with a gradient or a curvature for facilitating the release of the terminal connecting portion subjected to covering and molding from the mold, whereby the terminal connecting portion subjected to covering and molding remains in the molding portion of the lower mold during mold releasing.


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