The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2004

Filed:

May. 06, 2002
Applicant:
Inventors:

Stefan Weber, Wertheim, DE;

Alfred Kemper, Warstein, DE;

Assignee:

Pink GmbH Vakuumtechnik, Wertheim, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/008 ; B23K 3/04 ;
U.S. Cl.
CPC ...
B23K 1/008 ; B23K 3/04 ;
Abstract

A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier. At least one component is heated in a melt chamber ( ) in a process atmosphere which is sealed off from the environment. In a subsequent step the component is cooled in a cooling chamber ( ) in a process atmosphere which is sealed off from the environment. The component is heated and cooled in process chamber ( ) which are independent of each other.


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