The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2004
Filed:
Dec. 28, 1998
Applicant:
Inventor:
Shuichi Matsuda, Tokyo, JP;
Assignee:
NEC Electronics Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/343 ; H01L 2/348 ; H01L 2/940 ; H01L 2/314 ;
U.S. Cl.
CPC ...
H01L 2/343 ; H01L 2/348 ; H01L 2/940 ; H01L 2/314 ;
Abstract
A semiconductor device equipped with a TAB (tape automated bonding) tape. A desired pattern of wiring is formed on one surface of the TAB tape and a semiconductor chip having two or more chip electrodes is disposed on the other surface of the TAB tape. The wiring and the chip electrodes are electrically interconnected via bumps that are formed in through-holes of the wiring in conforming relationship with the chip electrodes. This prevents fault connection between the chip electrodes and the bumps.