The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2004
Filed:
Oct. 08, 2003
Tatsuo Fujii, Osaka, JP;
Makoto Nakano, Osaka, JP;
Yuji Mido, Osaka, JP;
Katsumasa Miki, Osaka, JP;
Suzushi Kimura, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet ( ) is made porous and a dielectric coating ( ) is provided on the porous face ( ); an element forming stage where a solid electrolytic layer ( ) and a collector layer ( ) are formed on the dielectric coating ( ); and a terminal forming stage where a connecting terminal ( ) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer ( ); a forming through-hole electrode ( ) in a through-hole ( ) that is prepared on the valve metal sheet ( ); and forming the collector ( ) on the solid electrolytic layer ( ).