The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6794034 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 21, 2004

Filed:

Aug. 07, 2002
Applicant:
Inventors:

Masanori Ogawa, Tokai, JP;

Seinosuke Horiki, Takai, JP;

Takehiko Kajita, Tokai, JP;

Kuninori Itou, Tokai, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 2/704 ; B32B 2/738 ; C08L 6/300 ;
U.S. Cl.
CPC ...
B32B 2/704 ; B32B 2/738 ; C08L 6/300 ;
Abstract

A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfialkylated so as to have improved hydrophilicity.


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Ogawa, Masanori. (2004). Resin composition, molding material, and molded object (U.S. Patent No. 6794034). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6794034

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