The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2004

Filed:

Jan. 03, 2003
Applicant:
Inventor:

Tadatoshi Kinoshita, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 5/04 ;
U.S. Cl.
CPC ...
B21D 5/04 ;
Abstract

The present invention provides a bending die in which the fixed die and the rotary die are surface contacted to each other, the rotary die is rotated rearward after press forming to cause the workpiece to be moved away from the die, wherein the contact surface between the fixed die and the rotary die is formed in a flat surface. In addition, the present invention is set such that the rotary center point P of the rotary die is set outside the line drawn from one end C of the linear line indicating the contact surface of the rotary die in a direction of right angle in respect to the linear line when the contact surface is seen in a section of a direction perpendicular to the axis of the rotary die . With such an arrangement as above, a machining of the contact surface can be facilitated more and under a lower cost than those as compared with those forming the arcuate surface as found in the prior art.


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Kinoshita, Tadatoshi. (2004). Contact surface structure of bending die (U.S. Patent No. 6792785). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6792785

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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