The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2004

Filed:

Nov. 17, 2000
Applicant:
Inventors:

Tomishige Tai, Tokyo, JP;

Mitsuo Koguchi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/302 ; H01R 9/09 ;
U.S. Cl.
CPC ...
H01R 4/302 ; H01R 9/09 ;
Abstract

A method of making electrical connecting elements includes a metallic thin film is formed on a mold having protrusions complementary in shape to a conductor pattern to be formed; a substrate having a transfer layer of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer side of the substrate is brought into intimate contact with the metallic thin film laid over the protrusions , followed by pulling the transfer layer apart from the mold so as to transfer the metallic thin film covering the protrusions onto the transfer layer to thereby form the conductor pattern on the transfer layer


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