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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6791034 B1

PDFFull Text
Date of Patent:
Sep. 14, 2004

Filed:

Sep. 10, 2002

Circuit board and production method therefor

Applicant:
Inventors:

Masaki Suzumura, Mie, JP;

Kazuo Okada, Mie, JP;

Koichi Hirano, Osaka, JP;

Takaaki Okawa, Mie, JP;

Shinya Tanaka, Mie, JP;

Assignee:

Matsushita Electric Industrial Co., Ltd., Osaka, JP;

Attorney:

RatnerPrestia

Primary Examiner:

Kamand Cuneo

Assistant Examiner:

I B Patel

Int. Cl.
CPC ...
H05K 1/00 ;
U.S. Cl.
CPC ...
H05K 1/00 ;
Abstract

A lead frame of a circuit board is punched in a direction opposite to a heat sink plate. Even if burrs are produced due to the punching, the burrs do not penetrate a sheet or short-circuit to the heat sink plate. A resist film tightly contacts on the periphery of a land of the lead frame of the circuit board, and a plated layer tightly contacts on the land. This prevents electronic components from defective mounting on the land.

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Suzumura, Masaki. (2004). Circuit board and production method therefor (U.S. Patent No. 6791034). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6791034

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