The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2004

Filed:

Sep. 30, 2002
Applicant:
Inventors:

Kazuhiro Tsuruta, Nishio, JP;

Nobuaki Kawahara, Nisshin, JP;

Assignee:

DENSO Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1425 ;
U.S. Cl.
CPC ...
H01L 2/1425 ;
Abstract

A plurality of grooves, each having a depth of 10 &mgr;m or more and arranged adjacent to each other, are formed at a predetermined portion of a semiconductor substrate where a passive element is formed. Then, a thermal oxidation treatment is performed to let an oxide film grow from an inside surface of each groove so as to fill an inside space of the groove with a thermal oxide film thus grown and turn an entire portion intervening between adjacent grooves into a thermal oxide layer. Each groove has a width of 1 &mgr;m or less, and a width of a semiconductor material intervening between two adjacent grooves is 81.8% or more with respect to the groove width.


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