The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6790596 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 14, 2004

Filed:

Oct. 11, 2002
Applicant:
Inventors:

Masahiro Kubota, Otsu, JP;

Michiaki Iha, Otsu, JP;

Shizuharu Waatanabe, Omihachiman, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C 1/725 ; G03C 1/73 ; G03F 7/028 ; G03F 7/032 ; G03F 7/033 ;
U.S. Cl.
CPC ...
G03C 1/725 ; G03C 1/73 ; G03F 7/028 ; G03F 7/032 ; G03F 7/033 ;
Abstract

A photoreactive resin composition having high sensitivity and causing less gelation, and methods of manufacturing a circuit board and a ceramic multilayer substrate having a high-resolution wiring pattern and via holes by a photolithography process using the photoreactive resin composition are described. The photoreactive resin composition contains an inorganic powder containing a polyvalent metal powder and/or a polyvalent metal oxide powder, an alkali-soluble first polymer having an ethylenically unsaturated double bond, a monomer having an ethylenically unsaturated double bond, a photoreaction initiator, an organic solvent, and a second polymer having a pyrrolidone ring in a side chain.


Find Patent Forward Citations

Kubota, Masahiro. (2004). Photoreactive resin composition and method of manufacturing circuit board and ceramic multilayer substrate using the resin composition (U.S. Patent No. 6790596). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6790596

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